Journal: Journal of Micromechanics and Microengineering

Article Title: Efficient heat dissipation with hybrid composite-based microfluidic heat sinks in flexible electronics

doi: 10.1088/1361-6439/add89f

Figure Lengend Snippet: Figure 4. (A) Digital image of 3D printed dog-bone-like negative mould for fabricating the specimens specified as per ASTM-D638-IV standards for elasticity test. (B) Elasticity investigation for different materials (The results are represented as the Mean ± SD, based on three individual observations).

Article Snippet: To record the fluid temperature at the inlet and the outlet, a 3D printed device (utilising stereolithography 3D printer, Form3, Formlabs, Boston MA) at the inlet and outlet ports, integrated with the thermocouple was used, as shown in ESI figure S1 (inset picture).

Techniques:

Journal: Journal of Micromechanics and Microengineering

Article Title: Efficient heat dissipation with hybrid composite-based microfluidic heat sinks in flexible electronics

doi: 10.1088/1361-6439/add89f

Figure Lengend Snippet: Figure 6. Illustration of thermal management comparison of PDMS and PDMS-GO-PW material layer based on numerical analysis. (A) The 3D model utilized for numerical simulation. (B) Cross-section view at Plane-X sliced (y = 10 mm) to extract the temperature profile. (C) Temperature variation along the axial distance (I–I′) within the microfluidic heat sink, highlighting the improved thermal performance of PDMS-GO-PW compared to PDMS, with temperature reductions of 22 K and 8 K at different positions.

Article Snippet: To record the fluid temperature at the inlet and the outlet, a 3D printed device (utilising stereolithography 3D printer, Form3, Formlabs, Boston MA) at the inlet and outlet ports, integrated with the thermocouple was used, as shown in ESI figure S1 (inset picture).

Techniques: Comparison